Inquiries about the Products
Crystalline epoxy resin having a biphenyl structure. The melt viscosity is extremely low, and the balance of physical properties such as water absorption rate and rigidity is excellent. Suitable for semiconductor sealants and resist ink applications.
Biphenyl aralkyl type
Epoxy resin excellent in balance of physical properties such as flame retardancy, heat resistance, adhesion, low water absorption. It is suitable for semiconductor sealants, laminates and special electronic parts.
High molecular weight epoxy resin. A skeleton based on bisphenol A type Initially, various skeletons / functional groups were introduced to impart heat resistance and dielectric properties Special item number is also available. Suitable for film applications and special electronic parts applications.
Flexibility epoxy resin by means of molecular strucure or special modification technology
Tris hydroxyl phenyl methane type
It is characterized by high heat resistance because of high functional group density in molecular structure. Suitable for semiconductor sealant and laminated board applications.
Bis-phenol A type
The most versatile type among epoxy resins. We have a range of liquid to solid products depending on the difference in molecular weight. It is used in various applications ranging from paint / civil engineering field to electronic materials field.
Bis-phenol F type
Low viscosity compared with bisphenol A type. Since it is excellent in workability, it is suitable for casting agent and liquid sealant application.
Phenol novolac, cresol novolak, bisphenol A novolak etc. There are kinds. In order to balance heat resistance, water absorption, thermal expansion property and other physical properties Are better. It is suitable mainly for semiconductor sealant and epoxy molding material.
Glycidyle amine type
Epoxy resin based on p-aminophenol and DDM. It has low viscosity and heat resistance, so it is suitable for CFRP and liquid sealant applications.
Epoxy resin having dicyclopentadiene introduced into the molecule. Due to the bulky structure Low water absorption, low dielectric constant. Mainly for semiconductor encapsulant and laminate application Suitable.
Alicyclic epoxy resin obtained by hydrogenating a bisphenol A type epoxy resin. Low viscosity and excellent weather resistance, it is suitable for optical applications (LED sealing agent).