Epoxy Resins
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    Biphenyl type Crystalline epoxy resin having a biphenyl structure. The melt viscosity is extremely low, and the balance of physical properties such as water absorption rate and rigidity is excellent. Suitable for semiconductor sealants and resist ink applications.
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    Biphenyl aralkyl type Epoxy resin excellent in balance of physical properties such as flame retardancy, heat resistance, adhesion, low water absorption. It is suitable for semiconductor sealants, laminates and special electronic parts.
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    Phenoxy type High molecular weight epoxy resin. A skeleton based on bisphenol A type Initially, various skeletons / functional groups were introduced to impart heat resistance and dielectric properties Special item number is also available. Suitable for film applications and special electronic parts applications.
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    Flexibility type Flexibility epoxy resin by means of molecular strucure or special modification technology
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    Tris hydroxyl phenyl methane type It is characterized by high heat resistance because of high functional group density in molecular structure. Suitable for semiconductor sealant and laminated board applications.
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    Bis-phenol A type The most versatile type among epoxy resins. We have a range of liquid to solid products depending on the difference in molecular weight. It is used in various applications ranging from paint / civil engineering field to electronic materials field.
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    Bis-phenol F type Low viscosity compared with bisphenol A type. Since it is excellent in workability, it is suitable for casting agent and liquid sealant application.
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    Novolak type Phenol novolac, cresol novolak, bisphenol A novolak etc. There are kinds. In order to balance heat resistance, water absorption, thermal expansion property and other physical properties Are better. It is suitable mainly for semiconductor sealant and epoxy molding material.
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    Glycidyle amine type Epoxy resin based on p-aminophenol and DDM. It has low viscosity and heat resistance, so it is suitable for CFRP and liquid sealant applications.
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    Dicyclopentadiene type Epoxy resin having dicyclopentadiene introduced into the molecule. Due to the bulky structure Low water absorption, low dielectric constant. Mainly for semiconductor encapsulant and laminate application Suitable.
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    Hydrogenation type Alicyclic epoxy resin obtained by hydrogenating a bisphenol A type epoxy resin. Low viscosity and excellent weather resistance, it is suitable for optical applications (LED sealing agent).