Epoxy Curing Agents
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    Modified aliphatic polyamine Room temperature curing Various modified amine type curing agents such as epoxy adducts of polyamines, MXDA, IPDA, Mannich reaction products, and Michael reaction products. Often used for Corrosion-resistant paints and flooring paints.
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    Modified polyamide Room temperature curing Curing agents synthesized from a polymerized fatty acid or other carboxylic acid and polyamines as main raw materials, having an amide bond and many amino groups in the molecule. Often used for orrosion-resistant paints, civil engineering / building adhesives, casting agents and the like in many cases
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    Modified mercaptan Room temperature curing A curing agent having a mercapto group. Characterized by fast low temperature curing utilizing accelerators such as tertiary amines in combination. It is widely used from building materials to electric materials applications.
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    DICY (Dicyandiamide) Thermal curing It reacts at high temperature and is often used in one-pack formulations for laminates, casting agents, powder coatings etc. with its long pot life.
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    Phenol Thermal curing Excellent in heat resistance. Widely used in semiconductor sealing applications.
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    Aromatic amine Thermal curing It has high heat resistance and shows excellent electrical and mechanical performance under heat. It is often used for CFRP and FCCL applications.
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    Acid anhydride Thermal curing It has long pot life and shows excellent electrical & mechanical performance. With its superior workability at low viscosity, it is often used in casting/insulation and CFRP.
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    Hydrazide compound Thermal curing Very long pot life Pot life and excellent storage stability. It is often used as one-pack formulation for electric material adhesive.
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    Imidazole Accelerator With tertiary nitrogen contained, it is used as a curing accelerator for DICY, phenols, acid anhydride, etc., in addition to a sole curing agent performance by itself. Used in copper-clad laminate, semiconductor sealing agent, resist ink, structural adhesive etc. in many cases.
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    BF3 mono ethyl amine Accelerator Superior in heat resistance and chemical resistance properties. Known for its excellent latency with long pot life. It is used as a accelerator of DDS.
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    DBU derivatives Accelerator With its excellent electrical insulation properties, it is widely used as a semiconductor sealant. There is a salt type with phenol, etc.