Epoxy Curing Agents
Inquiries about the Products
Product Name
type
DICY (Dicyandiamide)
Thermal curing
It is used for prepreg (low and medium temperature curing) applications because of its excellent storage stability.
Product Name
type
Aromatic amine
Thermal curing
DDS is mainly used. Heat resistance can be imparted in cured resin by high temperature curing. Applicable to prepreg (high temperature curing), FW, RTM molding.
Product Name
type
Imidazole
Accelerator
Used as a curing accelerator for dicyandiamide for this application.