Epoxy Curing Agents
Inquiries about the Products
It is used for prepreg (low and medium temperature curing) applications because of its excellent storage stability.
DDS is mainly used. Heat resistance can be imparted in cured resin by high temperature curing. Applicable to prepreg (high temperature curing), FW, RTM molding.
Used as a curing accelerator for dicyandiamide for this application.