Inquiries about the Products
High molecular weight epoxy resin. A skeleton based on bisphenol A type Initially, various skeletons / functional groups were introduced to impart heat resistance and dielectric properties Special item number is also available. Suitable for film applications and special electronic parts applications.
Flexibility epoxy resin by means of molecular strucure or special modification technology
Bis-phenol A type
The most versatile type among epoxy resins. We have a range of liquid to solid products depending on the difference in molecular weight. It is used in various applications ranging from paint / civil engineering field to electronic materials field.
Bis-phenol F type
Low viscosity compared with bisphenol A type. Since it is excellent in workability, it is suitable for casting agent and liquid sealant application.
Phenol novolac, cresol novolak, bisphenol A novolak etc. There are kinds. In order to balance heat resistance, water absorption, thermal expansion property and other physical properties Are better. It is suitable mainly for semiconductor sealant and epoxy molding material.
Glycidyle amine type
Epoxy resin based on p-aminophenol and DDM. It has low viscosity and heat resistance, so it is suitable for CFRP and liquid sealant applications.
Alicyclic epoxy resin obtained by hydrogenating a bisphenol A type epoxy resin. Low viscosity and excellent weather resistance, it is suitable for optical applications (LED sealing agent).