Epoxy Curing Agents
    Product Name type
    Phenol Thermal curing With its excellent electrical properties and heat resistance, it is widely used in semiconductor sealing applications. Phenol aralkyl type and biphenyl aralkyl type are typical in application.
    Product Name type
    Acid anhydride Thermal curing Low viscosity and long pot life. It shows excellent heat resistance as well as its electrical & mechanical performance.
    Product Name type
    Imidazole Accelerator Used as accelerators for phenols and acid anhydrides. It has long pot life and shows high curability in the middle temperature range. Also, high heat resistance is obtaied in cured physical property.
    Product Name type
    DBU derivatives Accelerator Used as accelerators for the above phenols and acid anhydrides. Less coloring and high transparency can be obtained in cured resin. It is often used in salt with phenols or organic acids.